One epoxy modified single component product

The density ranges from 1.1 to 2.8, and the curing time is 50 degrees/4 hours or 110 degrees/30 minutes or 110 degrees/50 minutes;

2. It has moderate thixotropy and can cover and wrap electronic components when applied to circuit boards. The adhesive can level itself, but does not flow, and does not flow during baking and curing, maintaining its original shape;

3. The cured material has a black or amber bright light, strong adhesion to circuit boards and electronic components, and can withstand high temperatures of 200-300 ℃, strong acid and alkali corrosion, and various solvent corrosion;

4. High adhesive strength, good heat resistance, excellent solvent resistance, adhesive strength can achieve device damage, temperature resistance can also achieve device damage, and the cured material is not corroded by professional solvents, which can provide favorable protection for circuits and electronic components and prevent internal technical leakage of devices;

This product is suitable for confidential sealing of electronic devices. After curing, it has strong solvent resistance and can withstand long-term immersion in organic solvents; Has extremely high thermal deformation temperature and can resist high-temperature damage; At the same time, it has good hardness and wear resistance, and can resist the etching damage of general cutting tools.

Using this product to encapsulate electronic circuits has excellent anti decryption properties.

This product has the characteristics of easy use, long storage period, high bonding strength, fast curing speed, low shrinkage rate, non-toxic and harmless.

Store at room temperature for 70 days and in the refrigerator for more than six months.

Two component product modified with epoxy resin

It is a two-component thermosetting sealing material that becomes a dense solid structure after curing, with high hardness, good heat resistance, extremely difficult to disassemble, and can play a protective, waterproof, and confidential role.

Product Features:

1) Good adhesive strength and stable performance.

2) Low viscosity, good fluidity, no bubbles, and good toughness.

3) Good processability, can be cured at room temperature or heated, with fast curing speed and easy operation.

2. Usage: This product is divided into two components, A and B, with a ratio of 100:40. When using, the components A and B should be accurately weighed, thoroughly stirred into a uniform mixture, and poured according to the curing conditions.

3 curing conditions: 120 degrees/2 hours or 80 degrees/4-5 hours

4. Performance after curing:

1) Hardness:>80

2) Volume resistance: 2.6 × 1015 Ω - cm

3) Surface resistance: 3.7 × 1013 Ω

4) Breakdown voltage: 25kv/mm

5) Dielectric constant: 3.5@1KHz

6) Dielectric loss: 0.02

7) Impact strength:>9.5kg/cm

8) Bending strength:>900kg/cm

5. Transportation and Storage:

1) Both components A and B need to be sealed and stored in a dry and cool place;

2) The retention period is one year;

3) This product is not classified as dangerous goods and can be stored and transported as a general chemical.